Statistics
Total Visits
| Views | |
|---|---|
| Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions | 53 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions | 2 | 0 | 1 | 2 | 8 | 11 | 0 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| United States | 20 |
| Finland | 8 |
| Japan | 7 |
| Brazil | 4 |
| China | 4 |
| Czech Republic | 2 |
| Bangladesh | 1 |
| Bolivia | 1 |
| United Kingdom | 1 |
| Malaysia | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 7 |
| Tokyo | 6 |
| Oakland | 4 |
| Tianjin | 4 |
| Helsinki | 3 |
| Santa Adelia | 2 |
| Bristol | 1 |
| Dhaka | 1 |
| Espoo | 1 |
| Fremont | 1 |