Statistics
Total Visits
| Views | |
|---|---|
| Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies | 44 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies | 3 | 4 | 2 | 0 | 2 | 8 | 3 |
File Visits
| Views |
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Top country views
| Views | |
|---|---|
| United States | 17 |
| China | 5 |
| Finland | 5 |
| Japan | 4 |
| Brazil | 3 |
| Ecuador | 3 |
| Argentina | 1 |
| India | 1 |
| Mexico | 1 |
| Peru | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 9 |
| Tianjin | 4 |
| Tokyo | 4 |
| Menlo Park | 2 |
| Sao Goncalo | 2 |
| Tampere | 2 |
| Ada | 1 |
| Boydton | 1 |
| Caracas | 1 |
| Guayaquil | 1 |