A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips

dc.contributor.author	Boris Mirman
dc.contributor.author	Emanuel Bobrov
dc.date.accessioned	2017-05-09T00:04:34Z
dc.date.available	2017-05-09T00:04:34Z
dc.date.copyright	December, 2001
dc.date.issued	2001
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26198#405_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/125016
dc.description.abstract	Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips
dc.type	Journal Paper
dc.journal.volume	123
dc.journal.issue	4
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.1400975
dc.journal.fristpage	405
dc.identifier.eissn	1043-7398
dc.keywords	Metallurgy
dc.keywords	Fracture (Process)
dc.keywords	Flip-chip devices
dc.keywords	Deformation
dc.keywords	Copper AND High temperature
dc.tree	Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004
dc.contenttype	Fulltext