A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips

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Date
2001
Author
Boris Mirman
Emanuel Bobrov
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Abstract
Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips.
URI
http://yetl.yabesh.ir/yetl/handle/yetl/125016
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