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contributor authorW. S. Johnson
contributor authorW. C. Rister
contributor authorT. Spamer
date accessioned2017-05-08T23:04:57Z
date available2017-05-08T23:04:57Z
date copyrightJanuary, 1978
date issued1978
identifier issn0094-4289
identifier otherJEMTA8-26859#57_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/91117
description abstractA method is presented by which crack growth of damage tolerance type flaws can be predicted in adhesively bonded structure subjected to spectrum loading. The method accounts for a laminate stress intensity correction factor, induced bending and axial load transfer between plies, as well as a crack growth analysis procedure to predict the crack growth retardation behavior under spectrum load. Analytical predictions are compared to several test results to show the applicability of the prediction method presented.
publisherThe American Society of Mechanical Engineers (ASME)
titleSpectrum Crack Growth in Adhesively Bonded Structure
typeJournal Paper
journal volume100
journal issue1
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.3443451
journal fristpage57
journal lastpage63
identifier eissn1528-8889
keywordsSpectra (Spectroscopy)
keywordsFracture (Materials)
keywordsStress AND Laminates
treeJournal of Engineering Materials and Technology:;1978:;volume( 100 ):;issue: 001
contenttypeFulltext


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