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contributor authorR. Murata
contributor authorM. C. Shaw
date accessioned2017-05-08T23:01:27Z
date available2017-05-08T23:01:27Z
date copyrightMay, 1976
date issued1976
identifier issn1087-1357
identifier otherJMSEFK-27640#410_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/89054
description abstractIn the abrasive cut-off operation in which a thin rotating disk is plunged through a workpiece, chips must be stored as a grain traverses the entire width of work being ground. Also, heat flows radially inward from the wheel surface for a longer time the wider the workpiece, thus increasing the tendency to overheat the polymeric bond posts that hold the abrasive grains in place. Oscillation of the workpiece in a tangential direction tends to reduce the length of continuous contact between abrasive grain and work and significantly improves grinding performance when relatively wide workpieces are ground. This paper discusses the more important aspects of the abrasive cut-off operation with oscillation.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Abrasive Cut-off Operation With Oscillation
typeJournal Paper
journal volume98
journal issue2
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.3438891
journal fristpage410
journal lastpage422
identifier eissn1528-8935
keywordsOscillations
keywordsFlow (Dynamics)
keywordsHeat
keywordsGrinding
keywordsRotating Disks AND Wheels
treeJournal of Manufacturing Science and Engineering:;1976:;volume( 098 ):;issue: 002
contenttypeFulltext


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