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    Nanoscratch Simulation on a Copper Thin Film Using a Novel Multiscale Model

    Source: Journal of Nanomechanics and Micromechanics:;2014:;Volume ( 004 ):;issue: 002
    Author:
    Venkataraman Pandurangan
    ,
    T. Y. Ng
    ,
    Hua Li
    DOI: 10.1061/(ASCE)NM.2153-5477.0000084
    Publisher: American Society of Civil Engineers
    Abstract: A two-dimensional (2D) multiscale model to simulate the nanoscratching of a copper thin film is discussed in this paper. The multiscale model uses the classical molecular dynamics (MD) method to simulate the atomistic region, the strong-form meshless Hermite-Cloud method to simulate the continuum region, and a novel handshaking algorithm to couple them together. The dependence of the coefficient of friction on parameters such as the scratch speed, indentation depth, and lattice structure has been investigated. A new scheme is also proposed to translate the atomistic region during the simulation; it allows a constant atomistic region size to be maintained. By restricting the size of the atomic region, and by maintaining it to be constant through the use of an adaptive nodal distribution scheme, the multiscale model is able to provide an efficient solution to the nanoscratch problem, saving on computational resources.
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      Nanoscratch Simulation on a Copper Thin Film Using a Novel Multiscale Model

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    http://yetl.yabesh.ir/yetl1/handle/yetl/67588
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    contributor authorVenkataraman Pandurangan
    contributor authorT. Y. Ng
    contributor authorHua Li
    date accessioned2017-05-08T21:57:56Z
    date available2017-05-08T21:57:56Z
    date copyrightJune 2014
    date issued2014
    identifier other%28asce%29ps%2E1949-1204%2E0000081.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/67588
    description abstractA two-dimensional (2D) multiscale model to simulate the nanoscratching of a copper thin film is discussed in this paper. The multiscale model uses the classical molecular dynamics (MD) method to simulate the atomistic region, the strong-form meshless Hermite-Cloud method to simulate the continuum region, and a novel handshaking algorithm to couple them together. The dependence of the coefficient of friction on parameters such as the scratch speed, indentation depth, and lattice structure has been investigated. A new scheme is also proposed to translate the atomistic region during the simulation; it allows a constant atomistic region size to be maintained. By restricting the size of the atomic region, and by maintaining it to be constant through the use of an adaptive nodal distribution scheme, the multiscale model is able to provide an efficient solution to the nanoscratch problem, saving on computational resources.
    publisherAmerican Society of Civil Engineers
    titleNanoscratch Simulation on a Copper Thin Film Using a Novel Multiscale Model
    typeJournal Paper
    journal volume4
    journal issue2
    journal titleJournal of Nanomechanics and Micromechanics
    identifier doi10.1061/(ASCE)NM.2153-5477.0000084
    treeJournal of Nanomechanics and Micromechanics:;2014:;Volume ( 004 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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