| contributor author | C. Y. Lien | |
| contributor author | J. C. Liu | |
| date accessioned | 2017-05-08T21:51:17Z | |
| date available | 2017-05-08T21:51:17Z | |
| date copyright | January 2006 | |
| date issued | 2006 | |
| identifier other | %28asce%290733-9372%282006%29132%3A1%2851%29.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/64342 | |
| description abstract | Treatment of chemical mechanical polishing wastewater containing nanosized silica from semiconductor industry by dispersed air flotation was investigated. Very effective removal of particles from wastewater was found when cationic surfactant, cetyltrimethyl ammonium bromide (CTAB), was used as a collector. The flotation efficiency decreased slightly under a pH of 4.5. The zeta potential increased with a increasing concentration of CTAB, and flocculation of particles by CTAB was found. It is proposed that both the change of interface properties and the aggregation of particles contributed to flotation removal of particles. Longer reaction time and higher dosage were needed when | |
| publisher | American Society of Civil Engineers | |
| title | Treatment of Polishing Wastewater from Semiconductor Manufacturer by Dispersed Air Flotation | |
| type | Journal Paper | |
| journal volume | 132 | |
| journal issue | 1 | |
| journal title | Journal of Environmental Engineering | |
| identifier doi | 10.1061/(ASCE)0733-9372(2006)132:1(51) | |
| tree | Journal of Environmental Engineering:;2006:;Volume ( 132 ):;issue: 001 | |
| contenttype | Fulltext | |
