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contributor authorJian-Hua Yin
contributor authorWan-Huan Zhou
date accessioned2017-05-08T21:46:20Z
date available2017-05-08T21:46:20Z
date copyrightSeptember 2009
date issued2009
identifier other%28asce%29gt%2E1943-5606%2E0000059.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/61822
description abstractGrouted soil nails are widely used in slope stabilization. The influence of both grouting pressure and overburden stress on the soil-nail pullout interface shear resistance is still not well understood due to the complex of soil-grout interactions. A series of laboratory soil-nail pullout tests have been carried out on a completely decomposed granite soil in nearly saturated condition under a combination of different grouting pressures and overburden stresses. The pullout tests simulate the real construction process of a soil nail, including establishment of initial soil stresses in a soil slope, drilling a hole with stress release, grouting, and soil-nail pullout when the slope is sliding. The pullout box is well instrumented. Test data are collected automatically by a data logger. Typical test results are presented, explained, and discussed in this paper. The soil-nail interface shear resistance data from all tests are analyzed and interpreted. The study shows that the grouting pressure and overburden stress have interactional influence on the soil-nail pullout resistance. Based on the test results, a new empirical liner equation with two grouting pressure dependent parameters is proposed for calculation of soil-nail pullout resistance considering both grouting pressure and overburden stress. New understandings and findings from the study are presented.
publisherAmerican Society of Civil Engineers
titleInfluence of Grouting Pressure and Overburden Stress on the Interface Resistance of a Soil Nail
typeJournal Paper
journal volume135
journal issue9
journal titleJournal of Geotechnical and Geoenvironmental Engineering
identifier doi10.1061/(ASCE)GT.1943-5606.0000045
treeJournal of Geotechnical and Geoenvironmental Engineering:;2009:;Volume ( 135 ):;issue: 009
contenttypeFulltext


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