Digital Image Analysis of Dynamic Compaction Effects on Clay Fills

Abstract

This paper presents the findings of a digital image analysis based study of clay fills, compacted with dynamic compaction for a building foundation in northeast Beijing, People’s Republic of China. Three levels of compaction energy were used at three compaction pits, respectively. Ground settlements and soil density increased with the number of dynamic impact blows. Microstructures of dry clay fill samples from the pits were examined with a scanning electronic microscope (SEM). Their microstructural parameters were further measured and analyzed quantitatively using digital image analysis. The clay SEM images are automatically converted into ternary images representing particles, pores, and contact zones for effective and efficient calculation of the clay microstructural parameters. The effect of dynamic compaction on the clay microstructural properties at different blow numbers and compaction energy levels is examined. Analysis revealed that the changes of the soil microstructural properties have a good correlation with the observed ground settlements at the three pits. The ground settlements are due to the size and shape changes and reorientation of the grain particles and pores of the clay fills.