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contributor authorHe, Haiyu
contributor authorWang, Yuxi
contributor authorJiang, Zhiyao
contributor authorSong, Bai
date accessioned2025-04-21T10:13:58Z
date available2025-04-21T10:13:58Z
date copyright12/16/2024 12:00:00 AM
date issued2024
identifier issn2832-8450
identifier otherht_147_03_033501.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4305758
description abstractThe rapid development of various micro-electromechanical systems (MEMS) over the past few decades has served as a cornerstone for precisely probing thermal transport in a rich variety of nanomaterials and nanostructures, all the way down to single-walled carbon nanotubes and monolayer graphene. However, numerous materials that are macroscopic (millimeter scale and above) at least in one dimension, such as metal wires, carbon fibers, and polymer fibers/films, have remained largely inaccessible by MEMS-based experimental approaches. In light of the great fundamental and technological value of these materials, we propose the concept of “big-MEMS” here as an effort to fill this notable gap. The idea is to create macroscopic measurement devices through standard MEMS design and fabrication techniques. For demonstration, we present a novel process that enables silicon-based suspended heater/calorimeter devices of millimeter to centimeter dimensions to be fabricated reliably, reconfigurably, and at low cost. In particular, the beam thermal conductance of our big-MEMS devices can be tuned from around 1.1 to 0.2 mW/K. Combined with a temperature resolution down to about 20 μK, these devices are suitable for characterizing materials spanning a broad range of thermal conductivity. As an example, the thermal conductivity of platinum wires with a diameter of 20 μm and lengths up to 3.5 mm are measured. Moreover, intriguing transport phenomena such as divergent thermal conductivity in low-dimensional materials and heat flow mediated by surface polaritons can be explored considering their inherent need for multiscale analysis. In principle, our concept of big-MEMS can also be applied to the study of thermal diffusivity, heat capacity, charge transport, and beyond.
publisherThe American Society of Mechanical Engineers (ASME)
titleBig Micro-Electromechanical Systems for Thermal Measurement
typeJournal Paper
journal volume147
journal issue3
journal titleASME Journal of Heat and Mass Transfer
identifier doi10.1115/1.4066504
journal fristpage33501-1
journal lastpage33501-8
page8
treeASME Journal of Heat and Mass Transfer:;2024:;volume( 147 ):;issue: 003
contenttypeFulltext


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