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    Enhancing the Mechanical and Microstructural Properties of Low Expansive Clay Subgrade with Vinyl Acetate-Ethylene Polymer Incorporation

    Source: Journal of Materials in Civil Engineering:;2024:;Volume ( 036 ):;issue: 007::page 04024161-1
    Author:
    Mohammad Saberian
    ,
    Salpadoru Tholkamudalige Anupiya M. Perera
    ,
    Jiasheng Zhu
    ,
    Rajeev Roychand
    ,
    Jie Li
    ,
    George Wang
    DOI: 10.1061/JMCEE7.MTENG-17049
    Publisher: American Society of Civil Engineers
    Abstract: In recent years, the construction industry has shifted toward sustainability, replacing traditional binders with eco-friendly alternatives. One such alternative is vinyl acetate-ethylene (VAE) polymer, known for its hydrophobic properties and used in various construction materials. This study explores the potential of VAE polymer to stabilize expansive clay as road subgrade material. VAE polymer was introduced into low-plasticity clay in varying percentages (1%, 1.5%, and 2% by dry weight of clay), and the mixtures underwent a series of geotechnical tests (compaction, unconfined compressive strength (UCS), California bearing ratio (CBR), resilient modulus, shrinkage-swelling, and soil-water retention curve) and microstructural and chemical analyses [x-ray diffraction (XRD), x-ray fluorescence (XRF), microcomputed tomography (MicroCT), and thermogravimetric analysis (TGA)]. The results show that 1 adding 1% polymer resulted in the highest increase in mechanical strength (UCS, CBR, resilient modulus) by 34%, 40%, and 51%, respectively. Moreover, the incorporation of 2% polymer reduced the swelling-shrinkage potential by 67%. Microstructural analyses support these findings.
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      Enhancing the Mechanical and Microstructural Properties of Low Expansive Clay Subgrade with Vinyl Acetate-Ethylene Polymer Incorporation

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4299179
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    contributor authorMohammad Saberian
    contributor authorSalpadoru Tholkamudalige Anupiya M. Perera
    contributor authorJiasheng Zhu
    contributor authorRajeev Roychand
    contributor authorJie Li
    contributor authorGeorge Wang
    date accessioned2024-12-24T10:34:34Z
    date available2024-12-24T10:34:34Z
    date copyright7/1/2024 12:00:00 AM
    date issued2024
    identifier otherJMCEE7.MTENG-17049.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4299179
    description abstractIn recent years, the construction industry has shifted toward sustainability, replacing traditional binders with eco-friendly alternatives. One such alternative is vinyl acetate-ethylene (VAE) polymer, known for its hydrophobic properties and used in various construction materials. This study explores the potential of VAE polymer to stabilize expansive clay as road subgrade material. VAE polymer was introduced into low-plasticity clay in varying percentages (1%, 1.5%, and 2% by dry weight of clay), and the mixtures underwent a series of geotechnical tests (compaction, unconfined compressive strength (UCS), California bearing ratio (CBR), resilient modulus, shrinkage-swelling, and soil-water retention curve) and microstructural and chemical analyses [x-ray diffraction (XRD), x-ray fluorescence (XRF), microcomputed tomography (MicroCT), and thermogravimetric analysis (TGA)]. The results show that 1 adding 1% polymer resulted in the highest increase in mechanical strength (UCS, CBR, resilient modulus) by 34%, 40%, and 51%, respectively. Moreover, the incorporation of 2% polymer reduced the swelling-shrinkage potential by 67%. Microstructural analyses support these findings.
    publisherAmerican Society of Civil Engineers
    titleEnhancing the Mechanical and Microstructural Properties of Low Expansive Clay Subgrade with Vinyl Acetate-Ethylene Polymer Incorporation
    typeJournal Article
    journal volume36
    journal issue7
    journal titleJournal of Materials in Civil Engineering
    identifier doi10.1061/JMCEE7.MTENG-17049
    journal fristpage04024161-1
    journal lastpage04024161-14
    page14
    treeJournal of Materials in Civil Engineering:;2024:;Volume ( 036 ):;issue: 007
    contenttypeFulltext
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