| description abstract | Increased interest in compact heat exchangers (CHXs) to serve as intermediate heat exchangers of very high temperature reactors resulted in significant research and development on their design, analysis, and construction. Printed circuit heat exchangers are a type of CHXs with high thermal efficiency and compactness achieved through diffusion bonding a stack of etched plates with millimeter scaled channels. The diffusion bonding process changes the microstructural and mechanical properties of the wrought metal plates. The current nonnuclear design code ASME section VIII, division 1 captures the material property change through a “joint efficiency factor.” However, the current nuclear design code ASME section III, division 5 does not address or support the diffusion bonded material properties. Hence, there is a need to develop allowable stresses, isochronous curves, and fatigue life curves for various diffusion bonded alloys. In this study, Alloy 800H material was selected to establish the diffusion bonded material properties under tension, creep, fatigue, and creep-fatigue loads at elevated temperatures in the range 550–760 °C. A set of tests on diffusion bonded Alloy 800H (DB 800H) were performed and the acquired data are used in developing allowable stresses Sy, Su, Sr, Sm, St, Smt, So, isochronous curves and fatigue life curves according to the ASME section III, division 5 requirements. This paper also presents detailed procedures used in developing the ASME code section III division 5 design provisions for diffusion bonded Alloy 800H. | |
