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contributor authorHodes, Marc
contributor authorMahajan, Ravi
contributor authorRuder, Zvi
contributor authorSimon, Terry
contributor authorGeisler, Karl
contributor authorOhadi, Michael
contributor authorMaurer, Joseph
contributor authorAltman, David
contributor authorWilson, Jim
contributor authorZiskind, Gennady
contributor authorSpector, Mark
contributor authorCatton, Ivan
contributor authorDhir, Vijay
contributor authorFisher, Timothy
contributor authorAyyaswamy, Portonovo
contributor authorMikic, Boravoje
date accessioned2022-02-05T22:26:53Z
date available2022-02-05T22:26:53Z
date copyright2/2/2021 12:00:00 AM
date issued2021
identifier issn0022-1481
identifier otherht_143_03_030101.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4277549
description abstractProfessor Avram Bar-Cohen, affectionally known to everyone as Avi, passed away on Oct. 10, 2020. Throughout his life, distressingly cut short while he remained at his peak in every respect, Avi was foremost and supremely devoted to his family, exhibited contagious and indefatigable passion while making academically seminal and industrially paramount contributions to the fields of heat transfer and electronics packaging, and zealously pursued his other diverse interests ranging from economic theory to snowmobiling. We, a small contingent of the innumerable colleagues and, without exception, friends, within Avi's vast technical network are honored and humbled to pen this heartfelt tribute to him. Anyone who has attended a lecture by Avi is familiar with his mantra of “leave the world a better place,” Tikkun Olam in Hebrew. He was, in so very many ways, profoundly successful in this endeavor. A sampling of them are described here.
publisherThe American Society of Mechanical Engineers (ASME)
titleIn Memoriam: Professor Avram Bar-Cohen (1946–2020)
typeJournal Paper
journal volume143
journal issue3
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4049444
journal fristpage030101-1
journal lastpage030101-7
page7
treeJournal of Heat Transfer:;2021:;volume( 143 ):;issue: 003
contenttypeFulltext


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