| description abstract | A novel inorganic aqueous solution (IAS) is shown to have a better heat transfer performance than water when used as the working fluid in copper-made phase-change heat transfer devices. First, the physical properties of IAS are measured and compared to those of water. Another, a chemical analysis is performed, and the chemical reactions involved between IAS and the copper surface are listed and categorized by their contributions to the heat transfer performance. In addition, a capillary rise test is performed to show how each chemical contributes to the improvement of the surface wettability. Last, using IAS in copper-made phase-change heat transfer devices is discussed, and the main focus is how IAS improves the heat transfer performance by a smaller thermal resistance and a larger critical heat flux. The conclusion is validated by thermo-siphon tests at different inclination angles. | |
