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contributor authorSchindler, Florestan
contributor authorBrocker, Richard
contributor authorKlocke, Fritz
contributor authorMattfeld, Patrick
date accessioned2017-11-25T07:17:14Z
date available2017-11-25T07:17:14Z
date copyright2015/9/9
date issued2016
identifier issn1087-1357
identifier othermanu_138_01_011002.pdf
identifier urihttp://138.201.223.254:8080/yetl1/handle/yetl/4234458
description abstractPolycrystalline diamond (PCD) grinding takes an important role in the field of tool manufacture. Regardless, there is still lack of process knowledge about the occurring material removal mechanisms in PCD grinding. In order to get a better understanding of the process characteristics, the surface integrity zone of PCD inserts has been analyzed in detail after grinding for the first time. The drawn conclusion questions solely ductile or brittle behavior as removal mechanisms. Both thermal and mechanical process loads during the grinding process lead to thermophysical and chemical effects on a micro- and mesoscopic-scale and might thus have a significant impact on the material removal mechanism.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond
typeJournal Paper
journal volume138
journal issue1
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4029804
journal fristpage11002
journal lastpage011002-5
treeJournal of Manufacturing Science and Engineering:;2016:;volume( 138 ):;issue: 001
contenttypeFulltext


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