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contributor authorZhao, Ruzhen
contributor authorYao, Yao
contributor authorLuo, Yun
date accessioned2017-05-09T01:31:42Z
date available2017-05-09T01:31:42Z
date issued2016
identifier issn1932-6181
identifier othermed_010_02_021002.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/161991
description abstractInstruments used in endoscopic surgery (colonoscopy surgery or natural orifice transluminal endoscopic surgery (NOTES)) are flexible to be advanced in human body. However, when the end of the instrument reaches the target, the instrument should be rigid enough to hold its shape against external forces for better surgical accuracy. In order to obtain these two properties, a variable stiffness over tube based on lowmeltingpointalloy (LMPA) is proposed in this paper. The structure exploits the phase transformation property of the LMPA which enables the stiffness change of the over tube by heating and cooling. A prototype was fabricated using a special molding method, and experiments were carried out to evaluate its variable stiffness property and response characteristics. According to experimental results, it costs 17 s to make the over tube transform from rigid state to flexible state and 18 s to make the over tube transform from flexible state to rigid state. The experimental results also indicated that the over tube is very rigid in rigid state and flexible in compliant state. A heat insulation layer was assembled to prevent human tissue from thermal damage. The temperature of the outer wall of the over tube was 42.5 آ°C when hot water of 80 آ°C was pumped into the over tube continually with the help of the heat insulation layer.
publisherThe American Society of Mechanical Engineers (ASME)
titleDevelopment of a Variable Stiffness Over Tube Based on Low Melting Point Alloy for Endoscopic Surgery
typeJournal Paper
journal volume10
journal issue2
journal titleJournal of Medical Devices
identifier doi10.1115/1.4032813
journal fristpage21002
journal lastpage21002
identifier eissn1932-619X
treeJournal of Medical Devices:;2016:;volume( 010 ):;issue: 002
contenttypeFulltext


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