| contributor author | Tavakkoli, Fatemeh | |
| contributor author | Ebrahimi, Siavash | |
| contributor author | Wang, Shujuan | |
| contributor author | Vafai, Kambiz | |
| date accessioned | 2017-05-09T01:30:28Z | |
| date available | 2017-05-09T01:30:28Z | |
| date issued | 2016 | |
| identifier issn | 0022-1481 | |
| identifier other | gtp_138_10_102601.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/161626 | |
| description abstract | A comprehensive analysis and optimization of a threedimensional integrated circuit (3D IC) structure and its thermophysical attributes are presented in this work. The thermophysical and geometrical attributes studied in this paper include the die, device layer, heat sink, and heat spreader, which are critical structures within a 3D IC. The effect of the power density of the device layer which is the source of heat generation within the chip as well as the through silicon vias (TSV) and microbumps is also considered in our investigation. The thermophysical and geometrical parameters that have a significant impact on the thermal signature of the 3D IC as well as those that have an insignificant impact were established. The comprehensive analysis of different geometrical and thermophysical attributes can guide the design and optimization of a 3D IC structure and decrease the cost. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermophysical and Geometrical Effects on the Thermal Performance and Optimization of a Three Dimensional Integrated Circuit | |
| type | Journal Paper | |
| journal volume | 138 | |
| journal issue | 8 | |
| journal title | Journal of Heat Transfer | |
| identifier doi | 10.1115/1.4033138 | |
| journal fristpage | 82101 | |
| journal lastpage | 82101 | |
| identifier eissn | 1528-8943 | |
| tree | Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 008 | |
| contenttype | Fulltext | |
