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contributor authorMujumdar, Soham S.
contributor authorCurreli, Davide
contributor authorKapoor, Shiv G.
contributor authorRuzic, David
date accessioned2017-05-09T01:20:20Z
date available2017-05-09T01:20:20Z
date issued2015
identifier issn1087-1357
identifier othermanu_137_03_031007.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/158673
description abstractThis paper presents a microelectrodischarge machining (EDM) meltpool model to predict workpiece (anode) material removal from a single discharge microEDM process. To model the meltpool, heat transfer and fluid flow equations are solved in the domain containing dielectric and workpiece material. A level set method is used to identify solid and liquid fractions of the workpiece material when the material is molten by microEDM plasma heat flux. The plasma heat flux, plasma pressure and the radius of the plasma bubble have been estimated by a microEDM plasma model and serve as inputs to the meltpool model to predict the volume of material removed from the surface of the workpiece. Experiments are carried out to study the effect of interelectrode voltage and gap distance on the crater size. For interelectrode voltage in the range of 200–300 V and gap distance of 1,2 خ¼m, the model predicts crater diameter in the range of 78–96 خ¼m and maximum crater depth of 8–9 خ¼m for discharge duration of 2 خ¼s. The crater diameter values for most of experimental craters show good agreement with the simulated crater shapes. However, the model overpredicts the crater depths compared to the experiments.
publisherThe American Society of Mechanical Engineers (ASME)
titleModeling of Melt Pool Formation and Material Removal in Micro Electrodischarge Machining
typeJournal Paper
journal volume137
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4029446
journal fristpage31007
journal lastpage31007
identifier eissn1528-8935
treeJournal of Manufacturing Science and Engineering:;2015:;volume( 137 ):;issue: 003
contenttypeFulltext


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