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contributor authorMujumdar, Soham S.
contributor authorCurreli, Davide
contributor authorKapoor, Shiv G.
contributor authorRuzic, David
date accessioned2017-05-09T01:10:01Z
date available2017-05-09T01:10:01Z
date issued2014
identifier issn1087-1357
identifier othermanu_136_03_031011.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/155480
description abstractFor successful commercial adaptation of the خ¼EDM (micro electrodischarge machining) process, there is a need to increase the process efficiency by understanding the process mechanism. This paper presents a model of the plasma discharge phase of a single discharge خ¼EDM event in deionized water. The plasma discharge is modeled using global model approach in which the plasma is assumed to be spatially uniform, and equations of mass and energy conservation are solved simultaneously along with the dynamics of the plasma bubble growth. Given the input discharge voltage, current and the discharge gap, complete temporal description of the خ¼EDM plasma during the discharge time is obtained in terms of the composition of the plasma, temperature of electrons and other species, radius of the plasma bubble and the plasma pressure. For input electric field in the range of 10–2000 MV/m and discharge gap in the range of 0.5–20 خ¼m, timeaveraged electron density of 3.88أ—1024m330.33أ—1024m3 and timeaveraged electron temperature of 11,013–29,864 K are predicted. Experimental conditions are simulated and validated against the spectroscopic data from the literature. The output from this model can be used to obtain the amount of heat flux transferred to the electrodes during the خ¼EDM process.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Model of Micro Electro Discharge Machining Plasma Discharge in Deionized Water
typeJournal Paper
journal volume136
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4026298
journal fristpage31011
journal lastpage31011
identifier eissn1528-8935
treeJournal of Manufacturing Science and Engineering:;2014:;volume( 136 ):;issue: 003
contenttypeFulltext


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