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contributor authorThompson Pettes, Michael
contributor authorShi, Li
date accessioned2017-05-09T01:09:18Z
date available2017-05-09T01:09:18Z
date issued2014
identifier issn0022-1481
identifier otherht_136_03_032401.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/155219
description abstractUsing a silicon nitride cantilever with an integral silicon tip and a microfabricated platinum–carbon resistance thermometer located close to the tip, a method is developed to concurrently measure both the heat transfer through and adhesion energy of a nanoscale point contact formed between the sharp silicon tip and a silicon substrate in an ultrahigh vacuum atomic force microscope at near room temperature. Several models are used to evaluate the contact area critical for interpreting the interfacial resistance. Near fieldthermal radiation conductance was found to be negligible compared to the measured interface thermal conductance determined based on the possible contact area range. If the largest possible contact area is assumed, the obtained thermal interface contact resistance can be explained by a nanoconstriction model that allows the transmission of phonons from the whole Brillouin zone of bulk Si with an average finite transmissivity larger than 0.125. In addition, an examination of the quantum thermal conductance expression suggests the inaccuracy of such a model for explaining measurement results obtained at above room temperature.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Reexamination of Phonon Transport Through a Nanoscale Point Contact in Vacuum
typeJournal Paper
journal volume136
journal issue3
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4025643
journal fristpage32401
journal lastpage32401
identifier eissn1528-8943
treeJournal of Heat Transfer:;2014:;volume( 136 ):;issue: 003
contenttypeFulltext


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