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contributor authorLi, Linwen
contributor authorLi, Bin
contributor authorLi, Xiaochun
contributor authorEhmann, Kornel F.
date accessioned2017-05-09T01:00:29Z
date available2017-05-09T01:00:29Z
date issued2013
identifier issn1087-1357
identifier othermanu_135_04_041012.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/152371
description abstractTemperaturedistribution measurements in cutting tools during the machining process are extremely difficult and remain an unresolved problem. In this paper, cutting temperature distributions were measured by thin film thermocouples (TFTCs) embedded into polycrystalline cubic boron nitride (PCBN) cutting inserts in the immediate vicinity of the toolchip interface. The embedded TFTC array provides temperature measurements with a degree of spatial resolution (100 خ¼m) and dynamic response (150 ns) that is not possible with currently employed methods due to the microscale junction size of the TFTCs. Using these measurements during hard turning, steadystate, dynamic, as well as chip morphology and formation process analyses were performed based on the cutting temperature and cutting force variations in the cutting zone. It has been shown that the temperature changes in the cutting zone depend on the shearing band location in the chip and the thermal transfer rate from the heat generation zone to the cutting tool. Furthermore, it became evident that the material flow stress and the shearing bands greatly affect not only the chip formation morphology but also the cutting temperature field distributions in the cutting zone of the cutting insert.
publisherThe American Society of Mechanical Engineers (ASME)
titleExperimental Investigation of Hard Turning Mechanisms by PCBN Tooling Embedded Micro Thin Film Thermocouples
typeJournal Paper
journal volume135
journal issue4
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4023722
journal fristpage41012
journal lastpage41012
identifier eissn1528-8935
treeJournal of Manufacturing Science and Engineering:;2013:;volume( 135 ):;issue: 004
contenttypeFulltext


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