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contributor authorYiliang Liao
contributor authorYingling Yang
contributor authorGary J. Cheng
date accessioned2017-05-09T00:52:48Z
date available2017-05-09T00:52:48Z
date copyrightJune, 2012
date issued2012
identifier issn1087-1357
identifier otherJMSEFK-28530#034503_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/149654
description abstractThis letter investigates a unique process to generate enhanced laser shock by applying an active liquid confinement—hydrogen peroxide (H2 O2 ). The mechanism of fast chemical etching-assisted laser ablation is proposed. As a result, comparing with utilizing water as confinement, the efficiency of laser shock peening (LSP) of aluminum alloy 6061 with an active liquid confinement is improved by 150%, and the ablation rate of pulse laser ablation (PLA) of zinc is enhanced by 300%. This method breaks the major limitation of underwater pulsed laser processing caused by the breakdown plasma, with additional mechanisms to generate higher ablation rate and shock pressure under the same laser intensities.
publisherThe American Society of Mechanical Engineers (ASME)
titleEnhanced Laser Shock by an Active Liquid Confinement—Hydrogen Peroxide
typeJournal Paper
journal volume134
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4006552
journal fristpage34503
identifier eissn1528-8935
keywordsPressure
keywordsLasers
keywordsPlasmas (Ionized gases)
keywordsShock (Mechanics)
keywordsHydrogen
keywordsLaser hardening
keywordsMechanisms
keywordsAblation (Vaporization technology)
keywordsLaser ablation
keywordsEtching AND Water
treeJournal of Manufacturing Science and Engineering:;2012:;volume( 134 ):;issue: 003
contenttypeFulltext


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