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contributor authorDirk Werschmoeller
contributor authorXiaochun Li
contributor authorKornel Ehmann
date accessioned2017-05-09T00:52:37Z
date available2017-05-09T00:52:37Z
date copyright41244
date issued2012
identifier issn1087-1357
identifier otherJMSEFK-926545#manu_134_6_061004.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/149591
description abstractThis paper presents a novel approach for obtaining thermal data from the close vicinity (70–700 μm) of the tool-workpiece interface while machining hardened steel. Arrays of microthin film C-type thermocouples with a junction size of 5 μm × 5 μm were fabricated by standard microfabrication methods and have been successfully embedded into polycrystalline cubic boron nitride (PCBN) using a diffusion bonding technique. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were performed to examine material interactions at the bonding interface in order to determine optimal bonding parameters. Static and dynamic sensor performances have been characterized. The sensors exhibit excellent linearity up to 1300 °C, fast rise time of 150 ns, and sensitivity of ∼19 μV/ °C. The PCBN inserts instrumented with embedded thin film C-type thermocouples were successfully applied to measure internal tool temperatures as close as 70 μm to the cutting edge while machining hardened steel workpieces at industrially relevant cutting conditions. Correlations between temperature and cutting parameters have been established. The embedded microthin film sensor array provided unprecedented temporal and spatial resolution as well as high accuracy for microscale transient tool-internal temperature field measurements. Tool-internal temperature maps were generated from acquired data. In the frequency domain, obtained thermal data indicated the onset of regenerative machining chatter earlier and more effective than conventional force measurement by dynamometer.
publisherThe American Society of Mechanical Engineers (ASME)
titleMeasurement of Transient Tool-Internal Temperature Fields During Hard Turning by Insert-Embedded Thin Film Sensors
typeJournal Paper
journal volume134
journal issue6
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4007621
journal fristpage61004
identifier eissn1528-8935
keywordsTemperature
keywordsMachining
keywordsSensors
keywordsCutting
keywordsBonding
keywordsThermocouples
keywordsDiffusion bonding (Metals)
keywordsChatter
keywordsThin film sensors AND Turning
treeJournal of Manufacturing Science and Engineering:;2012:;volume( 134 ):;issue: 006
contenttypeFulltext


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