| contributor author | Dongying Liu | |
| contributor author | Weiqiu Chen | |
| date accessioned | 2017-05-09T00:50:46Z | |
| date available | 2017-05-09T00:50:46Z | |
| date copyright | July, 2012 | |
| date issued | 2012 | |
| identifier issn | 0094-4289 | |
| identifier other | JEMTA8-27156#031002_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/148973 | |
| description abstract | The mechanics of a small-scaled bilayer film-substrate system subject to temperature variation is studied. The modified couple stress theory is employed to take account of the size effects that are usually observed in small-scaled structures. In addition, the effect of weak bonding between the film and substrate is examined by using a linear slip-type model. Exact solutions are derived and the closed-form expressions for residual thermal stress and curvature of the system are given. Modified Stoney’s formulas are also presented for the bilayer system with perfect interface or imperfect interface between the film and the substrate. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Modified Stoney's Formulas for Small-Scaled Bilayer Systems | |
| type | Journal Paper | |
| journal volume | 134 | |
| journal issue | 3 | |
| journal title | Journal of Engineering Materials and Technology | |
| identifier doi | 10.1115/1.4006509 | |
| journal fristpage | 31002 | |
| identifier eissn | 1528-8889 | |
| keywords | Stress | |
| keywords | Formulas | |
| keywords | Temperature | |
| keywords | Thermal stresses AND Bonding | |
| tree | Journal of Engineering Materials and Technology:;2012:;volume( 134 ):;issue: 003 | |
| contenttype | Fulltext | |
