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contributor authorS. Sathyanarayanan
contributor authorA. Vimala Juliet
date accessioned2017-05-09T00:46:17Z
date available2017-05-09T00:46:17Z
date copyrightAugust, 2011
date issued2011
identifier issn1949-2944
identifier otherJNEMAA-28064#034502_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/147306
description abstractMicromachining technology has greatly benefited from the success of developments in implantable biomedical microdevices. In this paper, microelectromechanical systems (MEMS) capacitive pressure sensor operating for biomedical applications in the range of 20–400 mm Hg was designed. Employing the microelectromechanical systems technology, high sensor sensitivities and resolutions have been achieved. Capacitive sensing uses the diaphragm deformation-induced capacitance change. The sensor composed of a rectangular polysilicon diaphragm that deflects due to pressure applied over it. Applied pressure deflects the 2 µm diaphragm changing the capacitance between the polysilicon diaphragm and gold flat electrode deposited on a glass Pyrex substrate. The MEMS capacitive pressure sensor achieves good linearity and large operating pressure range. The static and thermo electromechanical analysis were performed. The finite element analysis data results were generated. The capacitive response of the sensor performed as expected according to the relationship of the spacing of the plates.
publisherThe American Society of Mechanical Engineers (ASME)
titleSimulation of Low Pressure MEMS Sensor for Biomedical Application
typeJournal Paper
journal volume2
journal issue3
journal titleJournal of Nanotechnology in Engineering and Medicine
identifier doi10.1115/1.4004025
journal fristpage34502
identifier eissn1949-2952
keywordsPressure
keywordsSensors
keywordsCapacitance
keywordsDiaphragms (Structural)
keywordsPressure sensors
keywordsMicroelectromechanical systems
keywordsBiomedicine
keywordsSimulation
keywordsElectrodes
keywordsPlates (structures) AND Finite element analysis
treeJournal of Nanotechnology in Engineering and Medicine:;2011:;volume( 002 ):;issue: 003
contenttypeFulltext


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