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contributor authorJiAn Duan
contributor authorDeFu Liu
date accessioned2017-05-09T00:45:33Z
date available2017-05-09T00:45:33Z
date copyrightApril, 2011
date issued2011
identifier issn1087-1357
identifier otherJMSEFK-28447#024504_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/146918
description abstractThe purpose of this paper is to reveal material removal mechanisms of optical fiber end-surface in lapping processes. The lapping process experiments are conducted using fixed diamond abrasive lapping films with various particle sizes of 6 μm, 3 μm, 1 μm, and 0.5 μm. The micrographs of the optical fiber end-surfaces are observed using a scanning electron microscope. The experimental results show that there exist three material removal modes in the lapping processes: brittle fracture mode, semibrittle and semiductile mode, and ductile mode. These modes are mainly controlled by abrasive particle size, and there appears a brittle-ductile transition’s critical point when lapping films with a particle size of 3 μm are used to lap optical fiber end-surfaces. An interpretation is proposed for the formation mechanism of the plastic deformed layer on the optical fiber end-surfaces.
publisherThe American Society of Mechanical Engineers (ASME)
titleOn the Lapping Mechanism of Optical Fiber End-Surfaces Using Fixed Diamond Abrasive Films
typeJournal Paper
journal volume133
journal issue2
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4003792
journal fristpage24504
identifier eissn1528-8935
keywordsParticulate matter
keywordsGrinding
keywordsDiamonds
keywordsOptical fiber
keywordsMechanisms
keywordsBrittle fracture AND Brittleness
treeJournal of Manufacturing Science and Engineering:;2011:;volume( 133 ):;issue: 002
contenttypeFulltext


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