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contributor authorS. K. Tiwari
contributor authorB. K. Paul
date accessioned2017-05-09T00:39:19Z
date available2017-05-09T00:39:19Z
date copyrightJune, 2010
date issued2010
identifier issn1087-1357
identifier otherJMSEFK-28371#030902_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/144041
description abstractTransient liquid phase diffusion brazing is used in precision, hermetic joining applications as a replacement for diffusion bonding to reduce cycle times, reduce bonding pressure, and improve yields. In the present study, stainless steel 316L laminae are diffusion brazed with an interlayer of nickel nanoparticles and compared with samples joined by conventional diffusion bonding and electroplated nickel-phosphorous diffusion brazing. Comparison is made with regard to microstructural evolution, diffusional profile, and bond strength. All bonding was carried out in a uni-axial vacuum hot press at 1000°C with a heating rate of 10°C/min, a dwell time of 2 h and a bonding pressure of 10 MPa. Bond strength measurements show that the sample brazed with a nickel nanoparticle interlayer has the lowest void fraction at 4.8±0.9% and highest shear strength at 141.3±7.0 MPa. Wavelength dispersive spectroscopic analysis of sample cross-sections shows substantial diffusion of Ni and Fe across the nickel nanoparticle bond line. Scanning electron micrographs show no secondary phases along the nickel nanoparticle bond line.
publisherThe American Society of Mechanical Engineers (ASME)
titleComparison of Nickel Nanoparticle-Assisted Diffusion Brazing of Stainless Steel to Conventional Diffusion Brazing and Bonding Processes
typeJournal Paper
journal volume132
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4001554
journal fristpage30902
identifier eissn1528-8935
keywordsDiffusion (Physics)
keywordsNickel
keywordsBonding
keywordsBrazing
keywordsNanoparticles
keywordsStainless steel
keywordsDiffusion bonding (Metals) AND Temperature
treeJournal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 003
contenttypeFulltext


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