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contributor authorPatrick E. Hopkins
contributor authorJustin R. Serrano
contributor authorLeslie M. Phinney
contributor authorSean P. Kearney
contributor authorThomas W. Grasser
contributor authorC. Thomas Harris
date accessioned2017-05-09T00:38:51Z
date available2017-05-09T00:38:51Z
date copyrightAugust, 2010
date issued2010
identifier issn0022-1481
identifier otherJHTRAO-27893#081302_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143796
description abstractPump-probe transient thermoreflectance (TTR) techniques are powerful tools for measuring the thermophysical properties of thin films, such as thermal conductivity, Λ, or thermal boundary conductance, G. This paper examines the assumption of one-dimensional heating on, Λ and G, determination in nanostructures using a pump-probe transient thermoreflectance technique. The traditionally used one-dimensional and axially symmetric cylindrical conduction models for thermal transport are reviewed. To test the assumptions of the thermal models, experimental data from Al films on bulk substrates (Si and glass) are taken with the TTR technique. This analysis is extended to thin film multilayer structures. The results show that at 11 MHz modulation frequency, thermal transport is indeed one dimensional. Error among the various models arises due to pulse accumulation and not accounting for residual heating.
publisherThe American Society of Mechanical Engineers (ASME)
titleCriteria for Cross-Plane Dominated Thermal Transport in Multilayer Thin Film Systems During Modulated Laser Heating
typeJournal Paper
journal volume132
journal issue8
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4000993
journal fristpage81302
identifier eissn1528-8943
keywordsThin films
keywordsLasers
keywordsMeasurement
keywordsThermal conductivity
keywordsPumps
keywordsProbes
keywordsTop-tensioned risers
keywordsHeating
keywordsHeat conduction
keywordsElectrical conductance
keywordsThermoreflectance
keywordsGlass
keywordsSignals
keywordsTemperature AND Heat
treeJournal of Heat Transfer:;2010:;volume( 132 ):;issue: 008
contenttypeFulltext


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