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contributor authorDouglas E. Spearot
contributor authorDavid L. McDowell
date accessioned2017-05-09T00:32:52Z
date available2017-05-09T00:32:52Z
date copyrightOctober, 2009
date issued2009
identifier issn0094-4289
identifier otherJEMTA8-27122#041204_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140569
description abstractThe objective of this review article is to provide a concise discussion of atomistic modeling efforts aimed at understanding the nanoscale behavior and the role of grain boundaries in plasticity of metallic polycrystalline materials. Atomistic simulations of grain boundary behavior during plastic deformation have focused mainly on three distinct configurations: (i) bicrystal models, (ii) columnar nanocrystalline models, and (iii) 3D nanocrystalline models. Bicrystal models facilitate the isolation of specific mechanisms that occur at the grain boundary during plastic deformation, whereas columnar and 3D nanocrystalline models allow for an evaluation of triple junctions and complex stress states characteristic of polycrystalline microstructures. Ultimately, both sets of calculations have merits and are necessary to determine the role of grain boundary structure on material properties. Future directions in grain boundary modeling are discussed, including studies focused on the role of grain boundary impurities and issues related to linking grain boundary mechanisms observed via atomistic simulation with continuum models of grain boundary plasticity.
publisherThe American Society of Mechanical Engineers (ASME)
titleAtomistic Modeling of Grain Boundaries and Dislocation Processes in Metallic Polycrystalline Materials
typeJournal Paper
journal volume131
journal issue4
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.3183776
journal fristpage41204
identifier eissn1528-8889
keywordsGrain boundaries
keywordsModeling
keywordsDislocations
keywordsNucleation (Physics)
keywordsMechanisms
keywordsDeformation AND Engineering simulation
treeJournal of Engineering Materials and Technology:;2009:;volume( 131 ):;issue: 004
contenttypeFulltext


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