Show simple item record

contributor authorA. R. Griffin
contributor authorA. Vijayakumar
contributor authorR.-H. Chen
contributor authorK. B. Sundaram
contributor authorL. C. Chow
date accessioned2017-05-09T00:28:51Z
date available2017-05-09T00:28:51Z
date copyrightNovember, 2008
date issued2008
identifier issn0022-1481
identifier otherJHTRAO-27847#114501_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/138430
description abstractA heater designed to monitor surface temperature fluctuations during pool boiling and spray cooling experiments while the bubbles are simultaneously being observed has been fabricated and tested. The heat source was a transparent indium tin oxide (ITO) layer commercially deposited on a fused quartz substrate. Four copper-nickel thin film thermocouples (TFTCs) on the heater surface measured the surface temperature, while a thin layer of sapphire or synthetic fused silica provided electrical insulation between the TFTCs and the ITO. The TFTCs were microfabricated using the lift-off process to deposit the nickel and copper metal films. The TFTC elements were 50μm wide and overlapped to form a 25×25μm2 junction. A DAQ program recorded the TFTC voltages at a sampling rate of 50kHz and sent a trigger to a high-speed camera to synchronize bubble images with the surface temperature data. As the bubbles and their contact rings grew over the TFTC junction, correlations between bubble behavior and surface temperature changes were demonstrated.
publisherThe American Society of Mechanical Engineers (ASME)
titleDevelopment of a Transparent Heater to Measure Surface Temperature Fluctuations Under Spray Cooling Conditions
typeJournal Paper
journal volume130
journal issue11
journal titleJournal of Heat Transfer
identifier doi10.1115/1.2952761
journal fristpage114501
identifier eissn1528-8943
keywordsTemperature
keywordsCooling
keywordsFluctuations (Physics)
keywordsBubbles
keywordsSprays
keywordsJunctions
keywordsPool boiling
keywordsThermocouples
keywordsTransparency
keywordsThin films
keywordsHeat
keywordsCopper AND Nickel
treeJournal of Heat Transfer:;2008:;volume( 130 ):;issue: 011
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record