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contributor authorMineo Nozaki
contributor authorMasao Sakane
contributor authorYutaka Tsukada
date accessioned2017-05-09T00:28:14Z
date available2017-05-09T00:28:14Z
date copyrightJanuary, 2008
date issued2008
identifier issn0094-4289
identifier otherJEMTA8-27103#011001_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/138106
description abstractThis paper studies the notch effect on low cycle fatigue of Sn–3.5Ag solder. Strain controlled push-pull low cycle fatigue tests were carried out using three circumferential notched specimens at 313K. Cycles to crack initiation were measured by an a.c. potential method, and cycles to failure and for crack propagation were also determined in experiments. Cycles to failure, to crack initiation, and for propagation decreased with elastic stress concentration factor but cycles to crack initiation were most sharply reduced with elastic stress concentration factor. Prediction methods of cycles to crack initiation, for propagation, and to failure were discussed from the data fitting and the local strain approach utilizing finite element analysis.
publisherThe American Society of Mechanical Engineers (ASME)
titleNotch Effect on Low Cycle Fatigue of Sn–3.5Ag Solder
typeJournal Paper
journal volume130
journal issue1
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2806237
journal fristpage11001
identifier eissn1528-8889
keywordsSolders
keywordsStress concentration
keywordsFracture (Materials)
keywordsCrack propagation
keywordsCycles
keywordsFailure
keywordsLow cycle fatigue
keywordsStress AND Finite element analysis
treeJournal of Engineering Materials and Technology:;2008:;volume( 130 ):;issue: 001
contenttypeFulltext


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