Constrained Layer Damping Treatments for Microstructures

Abstract

This paper presents a bulk micromachining process to fabricate micro-constrained layer treatments (MCLT) on a microstructure to increase its damping, and demonstrates the damping improvement through calibrated experiments. MCLT consists of a silicon base structure (e.g., beams or plates), a viscoelastic photoresist layer, and an aluminum constraining layer. Silicon base beams and plates are fabricated from {100} wafer through Ethylene-Diamine-Pyrocatechol etch and buffered oxide etch. A 4.5-μm thick photoresist AZ4620 is spun on the silicon base beam as the viscoelastic layer. Finally, an aluminum layer is deposited through low-pressure vapor deposition as the constraining layer. To evaluate damping performance of MCLT, silicon beams with and without MCLT are subjected to swept-sine excitations by PZT from 0 to 100 kHz. In addition, a laser Doppler vibrometer and a spectrum analyzer measured frequency response functions (FRF) of the specimen. A finite element analysis identifies the resonance modes measured in FRF. Experimental results confirm that MCLT can increase damping of silicon beams by at least 40%. Significantly better damping performance is expected, if the loss factor of the viscoelastic layer is increased.