Show simple item record

contributor authorM. Bhagavat
contributor authorV. Prasad
contributor authorI. Kao
date accessioned2017-05-09T00:03:27Z
date available2017-05-09T00:03:27Z
date copyrightApril, 2000
date issued2000
identifier issn0742-4787
identifier otherJOTRE9-28688#394_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/124360
description abstractFree abrasive machining (FAM) process associated with the wiresaw wafer slicing involves a three body abrasion environment. During the process, the cutting action is caused by fine abrasives freely dispersed in the slurry, which get trapped between an axially moving taut wire and the ingot being sliced. In this paper a model is proposed wherein the entry of abrasives into the cutting zone is governed by elasto-hydrodynamic (EHD) interaction between the slurry and the wire. An EHD film is formed by the abrasive carrying viscous slurry, squeezed between the wire and the ingot. This phenomenon is analyzed here using the finite element method. The analysis of such an interaction involves coupling of the basic Reynold’s equation of hydrodynamics with the elasticity equation of wire. Newton–Raphson algorithm is used to formulate and solve this basic coupling. The finite element discretization of the resulting nonlinear equation is carried out using Galerkin’s method of weighted residuals. Basic hydrodynamic interaction model and the incorporation of the entry level impact pressure into the inlet boundary conditions are the two novel features introduced in this work. The analysis yields film thickness profile and pressure distribution as a function of wire speed, slurry viscosity, and slicing conditions. A perusal of results suggests that the wiresawing occurs under “floating” machining condition. The minimum film thickness is greater than the average abrasive size. This is practically very important since the wiresaw is used to slice fragile semiconductor wafers with severe requirements on the surface finish. The possible mechanism by which a floating abrasive can cause material removal is also touched upon in this work. Material removal rate has been modeled based on energy considerations. [S0742-4787(00)00702-5]
publisherThe American Society of Mechanical Engineers (ASME)
titleElasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis
typeJournal Paper
journal volume122
journal issue2
journal titleJournal of Tribology
identifier doi10.1115/1.555375
journal fristpage394
journal lastpage404
identifier eissn1528-8897
keywordsPressure
keywordsWire
keywordsSemiconductor wafers
keywordsStress
keywordsFinite element analysis
keywordsSlurries
keywordsCutting
keywordsFilm thickness
keywordsElectrohydrodynamics
keywordsModeling
keywordsAbrasives
keywordsViscosity
keywordsEquations
keywordsHydrodynamics AND Tension
treeJournal of Tribology:;2000:;volume( 122 ):;issue: 002
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record