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contributor authorZ. Wu
contributor authorJ. Lu
contributor authorPh.D. Student. Professor. Mem. ASME
date accessioned2017-05-09T00:02:34Z
date available2017-05-09T00:02:34Z
date copyrightApril, 2000
date issued2000
identifier issn0094-4289
identifier otherJEMTA8-27007#215_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/123782
description abstractA method combining moiré interferometry, Twyman–Green interferometry, and blind hole drilling method is proposed for simple and accurate determination of residual stress. The relationship between the three-dimensional surface displacements produced by introducing a blind hole and the corresponding residual stress is established by employing the Fourier expansion solution containing a set of undetermined coefficients. The coefficients are calibrated by 3D finite element method. The surface in-plane displacements Ux,Uy, and the out-of-plane displacement Uz produced by the relaxation of residual stress are measured by moiré interferometry and Twyman–Green interferometry, respectively, after the hole-drilling procedure. The complete three-dimensional displacement data at any single point around the hole can be used for residual stress determination. The accuracy of the method is analyzed and the experimental procedure is described to determine the sign of residual stresses. As an implementation of the method, a shot peening residual stress problem is studied. [S0094-4289(00)00802-1]
publisherThe American Society of Mechanical Engineers (ASME)
titleStudy of Surface Residual Stress by Three-Dimensional Displacement Data at a Single Point in Hole Drilling Method
typeJournal Paper
journal volume122
journal issue2
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.482790
journal fristpage215
journal lastpage220
identifier eissn1528-8889
keywordsDrilling
keywordsStress
keywordsDisplacement
keywordsInterferometry AND Calibration
treeJournal of Engineering Materials and Technology:;2000:;volume( 122 ):;issue: 002
contenttypeFulltext


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