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contributor authorF. Ren
contributor authorA. Chandra
contributor authorV. Tvergaard
date accessioned2017-05-08T23:57:15Z
date available2017-05-08T23:57:15Z
date copyrightMay, 1998
date issued1998
identifier issn1087-1357
identifier otherJMSEFK-27323#349_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/120775
description abstractProcess induced micro-scale evolutions can greatly influence the strength and resilience of a high temperature ceramic and intermetallic component. A micromechanical study, based on a unit cell approach, is carried out in the present work to investigate these evolutions during compaction of titanium aluminide multi-phase intermetallics at elevated temperatures. The quasi-coupled unit cell analysis can provide an avenue for investigating scalability and migratability of laboratory results to full scale productions with perturbed material compositions. Effects of various macro-scale process design considerations (e.g., tooling stiffness, spatial distribution of thermal fields) on micro-scale evolutions are investigated in detail. It has been observed that a more economic (and usually more flexible) container increases the likelihood of micro-crack nucleations, while spatially non-uniform intra-particle thermal fields can be utilized to alleviate processing induced micro-cracks in the final compacted product. Possibilities for process design modifications are also discussed.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Micromechanical Study of High Temperature Ti-Al Powder Compaction
typeJournal Paper
journal volume120
journal issue2
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.2830134
journal fristpage349
journal lastpage358
identifier eissn1528-8935
keywordsCompacting
keywordsHigh temperature
keywordsMicroscale devices
keywordsMicrocracks
keywordsProcess design
keywordsIntermetallic compounds
keywordsCeramics
keywordsContainers
keywordsParticulate matter
keywordsTooling
keywordsStiffness
keywordsTitanium aluminide AND Temperature
treeJournal of Manufacturing Science and Engineering:;1998:;volume( 120 ):;issue: 002
contenttypeFulltext


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