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contributor authorNeville Lee
contributor authorAjay Joneja
date accessioned2017-05-08T23:54:03Z
date available2017-05-08T23:54:03Z
date copyrightNovember, 1997
date issued1997
identifier issn1087-1357
identifier otherJMSEFK-27304#616_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/119016
description abstractIn modern manufacturing applications of products such as LCD’s, semiconductor wafers, and thin film heads, the workpiece has to be processed in multiple steps. The quality and yield of the products depends on how precisely the workpiece is aligned in each setup. The effect of imperfections of the workpiece on the manufacturing precision are analyzed, and our analysis shows that the imperfections of the workpiece can be a major cause of tolerance problems. A methodology that can help to greatly reduce the sensitivity of imperfections in the workpiece has been proposed. The methodology is applied to the 2-D domain, and is substantiated by characterization and analysis of samples from the LCD industry.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Methodology to Improve Manufacturing Precision in the Presence of Workpiece Imperfections
typeJournal Paper
journal volume119
journal issue4A
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.2831195
journal fristpage616
journal lastpage622
identifier eissn1528-8935
keywordsManufacturing
keywordsAccuracy
keywordsThin films AND Semiconductor wafers
treeJournal of Manufacturing Science and Engineering:;1997:;volume( 119 ):;issue: 4A
contenttypeFulltext


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