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contributor authorKai Xiong Hu
contributor authorAbhijit Chandra
date accessioned2017-05-08T23:41:56Z
date available2017-05-08T23:41:56Z
date copyrightFebruary, 1993
date issued1993
identifier issn1087-1357
identifier otherJMSEFK-27762#73_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/112270
description abstractStrength degradation of the finished part due to surface and sub-surface damage is a critical issue in grinding of ceramic materials. In this paper, the chip formation process is modeled as a two-dimensional system of radial and lateral cracks, and an integral equation approach is developed to investigate the interactions of these radial and lateral cracks with various distributions of planar microcracks. The effects in the vicinity of the free surface are modeled explicitly. The amplification and shielding effects on stress intensity factors due to various microcrack distributions are studied in detail. Numerical results are presented for crack systems representing single-grit as well as multi-grit grinding, and the implications of crack interactions on strength degradation of finished products are discussed. Effective elastic properties for workpieces containing microcrack distributions are obtained and their ramifications on the grinding process are investigated. Some benevolent microcrack distributions that will facilitate chip formation as well as suppress surface and subsurface damage evolution are also presented.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Fracture Mechanics Approach to Modeling Strength Degradation in Ceramic Grinding Processes
typeJournal Paper
journal volume115
journal issue1
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.2901642
journal fristpage73
journal lastpage84
identifier eissn1528-8935
keywordsFracture mechanics
keywordsCeramics
keywordsGrinding
keywordsModeling
keywordsFracture (Materials)
keywordsMicrocracks
keywordsElasticity
keywordsIntegral equations AND Stress
treeJournal of Manufacturing Science and Engineering:;1993:;volume( 115 ):;issue: 001
contenttypeFulltext


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