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contributor authorV. S. Bhattachar
contributor authorD. C. Stouffer
date accessioned2017-05-08T23:41:26Z
date available2017-05-08T23:41:26Z
date copyrightOctober, 1993
date issued1993
identifier issn0094-4289
identifier otherJEMTA8-26959#358_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111992
description abstractThe unified constitutive equations for René 80 developed by Bhattachar and Stouffer (1992) are used to predict the thermomechanical fatigue (TMF) response of a Nickel base superalloy René 80 between 649°C and 1093°C. Predictions using these equations suggest that temperature history effects are significant during TMF, and that the TMF response of René 80 cannot be predicted completely using only isothermal parameters. It is postulated without metallurgical observations that the two deformation mechanisms in René 80, planar slip at low temperatures and dislocation climb at high temperatures, produce characteristic microstructures which interact under nonisothermal conditions to produce extra hardening that is not present during isothermal deformation. A state variable approach has been used to model this interaction. The nonisothermal model with temperature history effects could successfully predict the initial and saturated TMF response, and block isothermal response of René 80 from several tests between 649°C and 1093°C.
publisherThe American Society of Mechanical Engineers (ASME)
titleConstitutive Equations for the Thermomechanical Response of René 80: Part 2—Effects of Temperature History
typeJournal Paper
journal volume115
journal issue4
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2904230
journal fristpage358
journal lastpage364
identifier eissn1528-8889
keywordsTemperature effects
keywordsConstitutive equations
keywordsTemperature
keywordsDeformation
keywordsFatigue
keywordsNickel
keywordsSuperalloys
keywordsHardening
keywordsLow temperature
keywordsDislocations
keywordsEquations
keywordsHigh temperature AND Mechanisms
treeJournal of Engineering Materials and Technology:;1993:;volume( 115 ):;issue: 004
contenttypeFulltext


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