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contributor authorJehnming Lin
contributor authorShinn-Liang Lee
contributor authorCheng-I Weng
date accessioned2017-05-08T23:38:34Z
date available2017-05-08T23:38:34Z
date copyrightJuly, 1992
date issued1992
identifier issn0094-4289
identifier otherJEMTA8-26951#289_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110320
description abstractThis paper presents a study of the inverse heat conduction problem for high speed machining. A finite element method with an inverse scheme and an experimental measurement using infrared (IR) pyrometer with fiber optic are applied to predict the tool-chip interface temperature and the total heat dissipating to both tungsten carbide and ceramic inserts. A one-dimensional ellipsoidal mapping model of the cutting temperature distribution is adopted here and the average transient cutting temperature is calculated by the inverse finite element method with measured surface temperatures adjacent to the tool edge. Also the analysis of the errors coming from the sensor location and mapping model is studied. The results show the estimated cutting temperature is well convergent and agrees to other previous investigations. It is found that the thermal conductivity of the tool material has significant effect on the heat dissipation but little effect on the tool-chip interface temperature in high speed machining.
publisherThe American Society of Mechanical Engineers (ASME)
titleEstimation of Cutting Temperature in High Speed Machining
typeJournal Paper
journal volume114
journal issue3
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.2904175
journal fristpage289
journal lastpage296
identifier eissn1528-8889
keywordsTemperature
keywordsHigh speed machining
keywordsCutting
keywordsHeat
keywordsFinite element methods
keywordsThermal conductivity
keywordsCeramics
keywordsFibers
keywordsSensors
keywordsHeat conduction
keywordsEnergy dissipation
keywordsErrors
keywordsPyrometers
keywordsTemperature distribution AND Tungsten
treeJournal of Engineering Materials and Technology:;1992:;volume( 114 ):;issue: 003
contenttypeFulltext


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