Thermal Aspects of Grinding: The Effect of the Wheel Bond on Heat Transfer to an Abrasive Grain

Abstract

Heat generated during grinding can cause thermal damage to the workpiece and wheel. It is therefore important to understand the thermal aspects of grinding. This paper addresses heat conduction into the wheel, by considering a single abrasive grain in contact with the workpiece. In particular, the effect of the bond material on conduction into the grain is investigated. The results for the grain surface temperature are given in terms of parameters describing the geometry and thermal properties of the grain and bond. The beneficial effect of a high thermal conductivity for both the grain and the bond is clearly demonstrated.