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contributor authorH. Arkin
contributor authorK. R. Holmes
contributor authorM. M. Chen
date accessioned2017-05-08T23:29:21Z
date available2017-05-08T23:29:21Z
date copyrightNovember, 1989
date issued1989
identifier issn0148-0731
identifier otherJBENDY-25852#276_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105040
description abstractA simple technique for measuring thermal conductivity of biomaterials is described. The method is based on depositing a pulse of heat into the material of choice, and fitting the subsequent local temperature decay to that predicted by a theoretical model. This transient method is most suitable in situations where frequent measurements of the thermal conductivity are desired. The method was evaluated by calculating the thermal conductivity of several inert materials. The measured conductivities compared well with published values. The developed technique was also used to examine the applicability of the “apparent conductivity” index to combine both conductive and blood-convective thermal effects in living, blood perfused tissues. Using both simulated and experimental results, it was shown that the changes in the apparent conductivity are highly correlated with changes in blood flow. However, quantitative application of this index must be restricted to conditions that are similar to those which existed at the time the apparent conductivity was measured.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Technique for Measuring the Thermal Conductivity and Evaluating the “Apparent Conductivity” Concept in Biomaterials
typeJournal Paper
journal volume111
journal issue4
journal titleJournal of Biomechanical Engineering
identifier doi10.1115/1.3168379
journal fristpage276
journal lastpage282
identifier eissn1528-8951
keywordsBiomaterials
keywordsThermal conductivity
keywordsConductivity
keywordsBlood
keywordsFittings
keywordsBlood flow
keywordsBiological tissues
keywordsTemperature effects
keywordsHeat
keywordsTemperature AND Measurement
treeJournal of Biomechanical Engineering:;1989:;volume( 111 ):;issue: 004
contenttypeFulltext


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