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Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A reliability study on anisotropically conductive adhesive joints on a Flip-Chip/FR-4 assembly has been carried out. In the study, nine types of anisotropic conductive adhesive (ACA) and one ...
Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and ...
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we ...