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    Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003:;page 240
    Author(s): Johan Liu; Zonghe Lai
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A reliability study on anisotropically conductive adhesive joints on a Flip-Chip/FR-4 assembly has been carried out. In the study, nine types of anisotropic conductive adhesive (ACA) and one ...
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    Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001:;page 43
    Author(s): Liqiang Cao; Zonghe Lai; Johan Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and ...
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    Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003:;page 177
    Author(s): Liu Caroline Chen; Zonghe Lai; Zhaonian Cheng; Johan Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we ...
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