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Notes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China
Publisher: The American Society of Mechanical Engineers (ASME)
Non-Fourier Heat Conduction in IC Chip
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Instead of the classic Fourier equation based on diffusion, a hyperbolic equation based on a wave model has been used to predict the rapid transient heat conduction in IC chips. The peak ...
Thermal Wave Based on the Thermomass Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In times comparable to the characteristic time of the energy carriers, Fourier’s law of heat conduction breaks down and heat may propagate as waves. Based on the concept of thermomass, which ...
Non-Fourier Heat Conduction in Carbon Nanotubes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fourier’s law is a phenomenological law to describe the heat transfer process. Although it has been widely used in a variety of engineering application areas, it is still questionable to reveal ...
A Novel Thermal Driving Force for Nanodevices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Design and construction of nanomotors are one of the most attractive fields in nanotechnology. Following the introduction of a novel concept of the thermomass, the relative mass of a phonon ...