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RISFinite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required ...
Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates ...
A Mechanistic Approach to the Prediction of Material Removal Rates in Rotary Ultrasonic Machining
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An approach to modeling the material removal rate (MRR) during rotary ultrasonic machining (RUM) of ceramics is proposed and applied to predicting the MRR for the case of magnesia stabilized ...
Physics-Based Predictive Cutting Force Model in Ultrasonic-Vibration-Assisted Grinding for Titanium Drilling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Ultrasonic-vibration-assisted grinding (UVAG) or rotary ultrasonic machining has been investigated both experimentally and theoretically. Effects of input variables on output variables in UVAG of ...
Support Vector Fuzzy Adaptive Network in the Modeling of Material Removal Rate in Rotary Ultrasonic Machining
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rotary ultrasonic machining (RUM) is one of the cost-effective machining methods for machining difficult to process material. It is a hybrid machining process that combines the material removal ...
Dynamic Process Modeling for Rotary Ultrasonic Machining of Alumina
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rotary ultrasonic machining (RUM) is a hybrid machining approach that combines two material removal mechanisms, namely, diamond grinding and ultrasonic machining. This paper presents the results ...
A Preliminary Study of the Effect of Surface Texture on Algae Cell Attachment for a Mechanical-Biological Energy Manufacturing System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A grand vision of an algal biofuel energy manufacturing system is presented here. The proposed system, from manufacturing engineering and system points of view, aims to provide technical solutions ...
Study on Edge Chipping in Rotary Ultrasonic Machining of Ceramics: An Integration of Designed Experiments and Finite Element Method Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Advanced ceramics have found a variety of engineering applications, thanks to their superior properties (such as high hardness and strength at elevated temperatures; chemical inertness; high wear ...
A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon is the primary semiconductor material used to fabricate microchips, and the quality of microchips depends directly upon the quality of the starting silicon wafers. One of the manufacturing ...
Vibration Amplitude in Rotary Ultrasonic Machining: A Novel Measurement Method and Effects of Process Variables
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rotary ultrasonic machining (RUM) has been used to machine both brittle and ductile materials as well as composite materials. There are numerous reported studies about the effects of various ...