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    Non-Fourier Heat Conduction in IC Chip 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003:;page 174
    Author(s): Zeng-Yuan Guo; Yun-Sheng Xu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Instead of the classic Fourier equation based on diffusion, a hyperbolic equation based on a wave model has been used to predict the rapid transient heat conduction in IC chips. The peak ...
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