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    Developing Case-Based Communities of Practice for Teaching the Legal Aspects of Construction: Lessons Learned in Taiwan 

    Source: Journal of Legal Affairs and Dispute Resolution in Engineering and Construction:;2009:;Volume ( 001 ):;issue: 004
    Author(s): Yu-Cheng Lin
    Publisher: American Society of Civil Engineers
    Abstract: To enhance the learning for graduate students to understand legal issues and dispute resolution in the construction industry, students can be provided with a learning platform for exchanging and sharing knowledge and ...
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    Developing WSN/BIM-Based Environmental Monitoring Management System for Parking Garages in Smart Cities 

    Source: Journal of Management in Engineering:;2020:;Volume ( 036 ):;issue: 003
    Author(s): Yu-Cheng Lin; Weng-Fong Cheung
    Publisher: ASCE
    Abstract: In recent years, there have been many serious problems with air pollution (such as hazardous gases) in environmental management for parking garages of cities. These problems should be continuously improved and enhanced for ...
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    Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004:;page 41005
    Author(s): Yu-Tang Yen; Te-Hua Fang; Yu-Cheng Lin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried ...
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    Use of Support Vector Regression to Improve Computational Efficiency of Stochastic Time-Cost Trade-Off 

    Source: Journal of Construction Engineering and Management:;2014:;Volume ( 140 ):;issue: 001
    Author(s): I-Tung Yang; Yu-Cheng Lin; Hsin-Yun Lee
    Publisher: American Society of Civil Engineers
    Abstract: Stochastic time-cost trade-off has been a popular object of investigation in past decades because there are uncertain factors that can be considered when determining the appropriate trade-off between project completion ...
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    Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003:;page 281
    Author(s): Tong Hong Wang; Chang-Chi Lee; Yi-Shao Lai; Yu-Cheng Lin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient ...
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