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    High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001:;page 58
    Author(s): Yoshiki Oshida; P. C. Chen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A five-layered (Cu/Cr/Kapton® /Cr/Cu) metallic thin film structure was subjected to a completely reversed bending fatigue cycling with a wide ranges of applied strain amplitudes from 0.25 ...
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    Time-Dependent Ductility of Electro-Deposited Copper 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004:;page 448
    Author(s): Yoshiki Oshida; P. C. Chen; T. Nishihara; J. D. Reid
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Mechanical ductility property of copper deposits is one of the most important factors necessary to provide a reliable component for the flexible printed circuit boards. Copper deposits are usually ...
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