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High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A five-layered (Cu/Cr/Kapton® /Cr/Cu) metallic thin film structure was subjected to a completely reversed bending fatigue cycling with a wide ranges of applied strain amplitudes from 0.25 ...
Time-Dependent Ductility of Electro-Deposited Copper
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Mechanical ductility property of copper deposits is one of the most important factors necessary to provide a reliable component for the flexible printed circuit boards. Copper deposits are usually ...
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