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    Fluid Flow Phenomena in Materials Processing—The 2000 Freeman Scholar Lecture 

    Source: Journal of Fluids Engineering:;2001:;volume( 123 ):;issue: 002:;page 173
    Author(s): Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There has been an explosive growth in the development of new materials and processing techniques in recent years to meet the challenges posed by new applications arising in electronics, ...
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    Editor's Farewell Note 

    Source: Journal of Heat Transfer:;2010:;volume( 132 ):;issue: 010:;page 100201
    Author(s): Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: It has been an honor and a privilege for me to serve as the Editor for the ASME Journal of Heat Transfer over the last five years. Though it has been challenging and time consuming, I ...
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    Microscale Transport Phenomena in Materials Processing 

    Source: Journal of Heat Transfer:;2009:;volume( 131 ):;issue: 003:;page 33111
    Author(s): Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Microscale transport mechanisms play a critical role in the thermal processing of materials because changes in the structure and characteristics of the material largely occur at these or smaller ...
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    Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 465
    Author(s): Tunc Icoz; Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents a methodology for the design and optimization of cooling systems for electronic equipment. In this approach, inputs from both experimentation and numerical modeling are to ...
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    Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002:;page 21008
    Author(s): Zhanyu Sun; Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper is directed at the numerical simulation of pressure-driven nitrogen slip flow in long microchannels, focusing on conjugate heat transfer under uniform heat flux wall boundary condition. ...
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    Transport Processes Governing the Drawing of a Hollow Optical Fiber 

    Source: Journal of Heat Transfer:;2009:;volume( 131 ):;issue: 007:;page 72102
    Author(s): Jing Yang; Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents a mathematical model to simulate the silica hollow optical fiber-drawing process. Two neck-down profiles, which represent the inner and outer surfaces of the hollow fiber, ...
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    Flow Structure and Heat Transfer in a Stagnation Flow CVD Reactor 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 008:;page 82501
    Author(s): Nasir Memon; Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental study is undertaken to investigate the flow structure and heat transfer in a stagnation flow chemical vapor deposition (CVD) reactor at atmospheric pressure. It is critical to ...
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    A Review of Microscale Transport in the Thermal Processing of New and Emerging Advanced Materials 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 006:;page 60906
    Author(s): Yogesh Jaluria; Jing Yang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper reviews the microscale transport processes that arise in the fabrication of advanced materials. In many cases, the dimensions of the device being fabricated are in the micrometer ...
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    Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 466
    Author(s): Tunc Icoz; Nitin Verma; Yogesh Jaluria
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The design of cooling systems for electronic equipment is getting more involved and challenging due to increase in demand for faster and more reliable electronic systems. Therefore, robust and ...
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    Special Issue: Micro/Nanoscale Heat and Mass Transfer Conference 

    Source: Journal of Heat Transfer:;2020:;volume( 142 ):;issue: 007:;page 070301-1
    Author(s): Hongbin, Ma; Yogesh, Jaluria; Zhuomin, Zhang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The papers selected from those presented at the conference were reviewed following the criteria set by the ASME Journal of Heat Transfer and are published in this special volume. These papers reflect the contemporary ...
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