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    Transient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 159
    Author(s): Li-Kang Liu; Wen-Shien Su; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Transient heat transfer behavior from a horizontally confined ceramic-based MCM disk with jet impingement has been systematically explored. The relevant parameters influencing heat transfer performance ...
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    A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003:;page 223
    Author(s): Tzer-Ming Jeng; Li-Kang Liu; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A novel semi-empirical model with an improved single blow method for exploring the heat transfer performance of porous aluminum-foam heat sinks in a channel has been successfully developed. The ...
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    Heat Transfer and Flow Friction Characteristics for Compact Cold Plates 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001:;page 104
    Author(s): Chang-Yuan Liu; Ying-Huei Hung; Professor and Chairman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Both experimental and theoretical investigations on the heat transfer and flow friction characteristics of compact cold plates have been performed. From the results, the local and average temperature ...
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    Optimal Design for PPF Heat Sinks in Electronics Cooling Applications 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 410
    Author(s): Han-Ting Chen; Jenn-Tsong Horng; Po-Li Chen; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed ...
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    Design Optimization for Pin-Fin Heat Sinks 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004:;page 397
    Author(s): Han-Ting Chen; Ying-Huei Hung; Po-Li Chen; Jenn-Tsong Horng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An effective method for performing the thermal optimization of fully confined pin-fin heat sinks under constraints of pressure drop, mass, and space limitations has been successfully developed. ...
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    Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal Technique 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004:;page 474
    Author(s): Ming-Chang Wu; Tiao-Yuan Wu; Sheng-Tzung Kuo; Meng-Ping Wang; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A series of experimental investigations with a new modified transient liquid crystal method on the studies related to the fluid flow and heat transfer characteristics in a channel installed ...
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    Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001:;page 82
    Author(s): Ta-Wei Lin; Ming-Chang Wu; Li-Kang Liu; Chun-Jen Fang; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A series of experimental investigations on the studies related to transient- and steady-state cooling performance from the horizontally heated heat sinks with a confined slot jet impingement have ...
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    Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 370
    Author(s): Ta-Wei Lin; Ming-Chang Wu; Cheng-Hsien Peng; Po-Li Chen; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal characteristics for a horizontal heated chip mounted with three types of nominally flat silicon-based heat spreaders have been systematically investigated. They include the natural convective ...
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